LP-NSML200

WAYON
DOCUMENT: M20497 REV LETTER: E PAGE NO: 1 OF 2 REV DATE: 2019-10-23 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 E-mail: market@way-on.com Http://www.way-on.com Surface mount fuses LP-NSML200 Features Small size of 1206 Low risistance Lead-free and compliant with the European Un...
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Внешний вид серии LP-NSM(L)

Технические характеристики

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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
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Аналоги 2

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Тип Наименование Корпус Упаковка i I удерж. I сраб. I макс U макс R Время Особенности Корпус Примечания T раб Карточка
товара
P= FSMD200-1206R (FUZETEC)
 
SMD120632X16MM в ленте 20 шт
 
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P= FSMD200-1206RZ (FUZETEC)
 
SMD120632X16MM
 
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Файлы 1

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DOCUMENT: M20497 REV LETTER: E PAGE NO: 1 OF 2 REV DATE: 2019-10-23 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 E-mail: market@way-on.com Http://www.way-on.com Surface mount fuses LP-NSML200 Features Small size of 1206 Low risistance Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast time-to-trip Product Dimensions (mm) Part number LP-NSML200 A B C D E Typ. Typ. Typ. Typ. Typ. 3.20±0.20 1.60±0.20 0.60±0.20 0.50±0.10 0.20±0.10 Part marking F Electrical Characteristics Part number LP-NSML200 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 2.0 4.0 6 50 8.0 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 2.0 0.8 0.005 0.030 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-NSML200 Hold Current (A) Trip Current (A) -40 2.68 5.36 -20 2.33 4.66 0 2.15 4.30 20 2.03 4.06 25 2.00 4.00 40 1.66 3.32 50 1.49 2.98 60 1.37 2.74 70 1.14 2.28 85 0.80 1.60 Solder Reflow Recommendations C Solder Pad Layouts B A B A B C (mm) (mm) (mm) LP-NSML200 1.80 1.00 1.80 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Part number Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-NSML200 

Shang Hai Wayon Thermo-Electro

Дата модификации: 25.10.2022

Размер: 236.8 Кб

2 стр.

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    MF-MSMF110/24X-2 (BOURNS)