LP-MSML750

WAYON
DOCUMENT: M20429 REV LETTER: D PAGE NO: 1 OF 2 REV DATE: 2020-07-08 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com LP-MSML750 Features  Small size of 1812  Low resistance  Lead-free and compliant with the ...
развернуть ▼ свернуть ▲
Внешний вид серии LP-MSM(L)

Технические характеристики

показать свернуть
Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
Нашли ошибку? Выделите её курсором и нажмите CTRL + ENTER

Файлы 1

показать свернуть
DOCUMENT: M20429 REV LETTER: D PAGE NO: 1 OF 2 REV DATE: 2020-07-08 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com LP-MSML750 Features  Small size of 1812  Low resistance  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Fast time-to-trip  Halogen-free  Agency Recognition: UL、TUV Product Dimensions (mm) A Part number LP-MSML750 B C D E Min. Max. Min. Max. Min. Max. Min. Max. Min. 4.37 4.73 3.07 3.41 0.60 1.00 0.20 0.95 0.20 Electrical Characteristics Maximum Electrical Rating  Operating Voltage: 6 Vdc  Interrupt Current: 50 A HOLD CURRENT AND TRIP CURRENT (AMPS) PART NUMBER 25℃ LP-MSML750 TIME-TO-TRIP (SECONDS) 60℃ REFERENCE RESISTANCE (OHMS) TRIPPED STATE POWER DISSIPATION (WATTS) 25℃ 25℃,6V 37.5 A @ 25℃ Hold Trip Hold Trip Min. Max. Min. Max. * Max. 7.5 15.0 5.8 11.6 - 5.0 0.0005 0.008 1.5 *: Maximum resistance is measured 1 hour after reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-MSML750 -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 11.35 9.95 8.70 7.64 7.50 6.76 6.28 5.80 4.95 3.52 Trip Current(A) 22.70 19.90 17.40 15.28 15.00 13.52 12.56 11.60 9.90 7.04 Solder Reflow Recommendations C Solder Pad Layouts B A B A B C (mm) (mm) (mm) LP-MSML750 3.45 1.78 3.15 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Part number Package Information Tape & Reel: 2000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSML750 

Shang Hai Wayon Thermo-Electro

Дата модификации: 13.07.2022

Размер: 232.6 Кб

2 стр.

    Внимание! Точность указанного на сайте описания товара не может быть гарантирована. Для получения более полной и точной информации о товаре смотрите техническое описание (Datasheet) на сайте производителя.

    MF-MSMF110/24X-2 (BOURNS)