LP-MSML500/12

WAYON
DOCUMENT: M20421 REV LETTER: D PAGE NO: 1 OF 2 REV DATE: 2020-07-31 PART NUMBER: LP-MSML500/12 Polymer PTC Devices Surface mount fuses Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21- 50310888 50968308 Fax: 86-21-50757680 E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 1812  Low resistance  Lead-free and compli...
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DOCUMENT: M20421 REV LETTER: D PAGE NO: 1 OF 2 REV DATE: 2020-07-31 PART NUMBER: LP-MSML500/12 Polymer PTC Devices Surface mount fuses Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21- 50310888 50968308 Fax: 86-21-50757680 E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 1812  Low resistance  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Fast time-to-trip  Agency Recognition: UL、TUV Product Dimensions (mm) A B C D E Typ. Typ. Typ. Typ. Typ. Part marking 4.50±0.20 3.20±0.20 1.10±0.20 0.45±0.15 0.40±0.15 W500-1 Part number LP-MSML500/12 Electrical Characteristics IH IT Vmax Imax (A) (A) (V) (A) Current(A) 5.00 10.0 12 50 25.0 Part number LP-MSML500/12 Ttrip Pd max Rmin R1max Time(S) (W) (Ω) (Ω) 5 1.5 0.002 0.014 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdmax=Maximum power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-MSML500/12 Hold Current (A) Trip Current (A) -40 7.36 14.72 -20 6.66 13.32 0 5.80 11.60 20 5.13 10.26 25 5.00 10.00 40 4.40 8.80 50 3.90 7.80 60 3.50 7.00 70 3.05 6.10 85 2.40 4.80 Solder Reflow Recommendations C Solder Pad Layouts B A B A B C (mm) (mm) (mm) LP-MSML500/12 3.45 1.78 3.15 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Part number Package Information Tape & Reel: 2000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Remark: This PPTC can withstand without damage at 14V. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSML500/12 

Shang Hai Wayon Thermo-Electro

Дата модификации: 04.08.2022

Размер: 237.2 Кб

2 стр.

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