LP-MSML500

WAYON
DOCUMENT: M20805 REV LETTER: B PAGE NO: 1 OF 2 REV DATE: 2020-07-31 PART NUMBER: LP-MSML500 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21- 50310888 50968308 Fax: 86-21-50757680 E-mail: market@way-on.com Http://www.way-on.com Surface mount fuses Features  Small size of 1812  Low resistance  Lead-free and complian...
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DOCUMENT: M20805 REV LETTER: B PAGE NO: 1 OF 2 REV DATE: 2020-07-31 PART NUMBER: LP-MSML500 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21- 50310888 50968308 Fax: 86-21-50757680 E-mail: market@way-on.com Http://www.way-on.com Surface mount fuses Features  Small size of 1812  Low resistance  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Fast time-to-trip  Halogen-free  Agency Recognition: UL、TUV Product Dimensions (mm) Part number LP-MSML500 A B C D E Max. Max. Max. Min. Min. Part Marking 4.73 3.41 0.60 0.30 0.20 W500 Electrical Characteristics Part number LP-MSML500 IH IT Vmax Imax Pd max Rmin R1max (A) (A) (V) (A) Current(A) Ttrip Time(S) (W) (Ω) (Ω) 5.00 10.0 6 50 25.0 5 1.5 0.002 0.010 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdmax=Maximum power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-MSML500 Hold Current (A) -40 -20 0 20 25 40 50 60 70 85 7.36 6.66 5.80 5.13 5.00 4.40 3.90 3.50 3.05 2.40 *Value specified were determined using the PWB with 3.4mm*1.0oz copper traces. Solder Reflow Recommendations C Solder Pad Layouts Part number LP-MSML500 B A B A (mm) 3.45 B (mm) 1.78 C (mm) 3.15 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 2000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSML500 

Shang Hai Wayon Thermo-Electro

Дата модификации: 04.08.2022

Размер: 231.3 Кб

2 стр.

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