LP-MSM260

WAYON
DOCUMENT: M20066 REV LETTER: I PAGE NO: 1 OF 2 DATE: 2019-12-27 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com E-mail: market@way-on.com Surface mount fuses LP-MSM260 Features Small size of 1812 Lead-free and compliant with the European Union RoHS Directive...
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DOCUMENT: M20066 REV LETTER: I PAGE NO: 1 OF 2 DATE: 2019-12-27 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com E-mail: market@way-on.com Surface mount fuses LP-MSM260 Features Small size of 1812 Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast tripping resettable circuit protection Surface mount packaging for automated assembly Agency Recognition: UL、TUV Product Dimensions (mm) Part number A B C D E Max. Max. Max. Min. Min. 4.73 3.41 1.80 0.30 0.30 LP-MSM260 Part Marking W 260 Electrical Characteristics IH IT Vmax Imax (A) (A) (V) (A) Current(A) 2.60 5.20 6 40 8.0 Part number LP-MSM260 Ttrip Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 2.50 1.0 0.015 0.047 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperatures(℃) LP-MSM260 -40 -20 0 25 40 50 60 70 85 Hold Current (A) 3.80 3.51 3.12 2.60 2.28 2.10 1.85 1.61 1.29 Trip Current (A) 7.60 7.02 6.24 5.20 4.56 4.20 3.70 3.22 2.58 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-MSM260 B A B A B C (mm) (mm) (mm) 3.45 1.78 3.15 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 1000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSM260 

Shang Hai Wayon Thermo-Electro

Дата модификации: 30.12.2022

Размер: 217.9 Кб

2 стр.

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    MF-MSMF110/24X-2 (BOURNS)