LP-MSM190

DOCUMENT: M20208 REV LETTER: D PAGE NO: 1 OF 2 REV DATE: 2019-12-13 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 E-mail: market@way-on.com Surface mount fuses LP-MSM190 Http://www.way-on.com Features Size 4420 Lead-free and compliant with the European Union RoHS Directive 2011/...
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DOCUMENT: M20208 REV LETTER: D PAGE NO: 1 OF 2 REV DATE: 2019-12-13 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 E-mail: market@way-on.com Surface mount fuses LP-MSM190 Http://www.way-on.com Features Size 4420 Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast tripping resettable circuit protection Surface mount packaging for automated assembly Product Dimensions (mm) Part number LP-MSM190 A B C D E Max. Max. Max. Min. Min. 12.00 5.33 0.75 0.80 0.30 Part Marking W 190 Electrical Characteristics Part number LP-MSM190 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 1.90 3.80 16 100 10.0 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 2.00 1.5 0.024 0.080 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Solder Reflow Recommendations C Solder Pad Layouts Part number LP-MSM190 B A B A B C (mm) (mm) (mm) 9.57 1.45 4.75 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSM190 

Shang Hai Wayon Thermo-Electro

Дата модификации: 16.12.2022

Размер: 211.3 Кб

2 стр.

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