LP-MSM175/16

WAYON
DOCUMENT: M20753 REV LETTER: B PAGE NO: 1 OF 2 REV DATE: 2020-07-31 PART NUMBER: LP-MSM175/16 Polymer PTC Devices Surface mount fuses Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21- 50310888 50968308 Fax: 86-21-50757680 E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 1812  Lead-free and compliant with the Europea...
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DOCUMENT: M20753 REV LETTER: B PAGE NO: 1 OF 2 REV DATE: 2020-07-31 PART NUMBER: LP-MSM175/16 Polymer PTC Devices Surface mount fuses Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21- 50310888 50968308 Fax: 86-21-50757680 E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 1812  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Fast tripping resettable circuit protection  Surface mount packaging for automated assembly  Agency Recognition: UL Product Dimensions (mm) Part number LP-MSM175/16 A B C D E Max. Max. Max. Min. Min. 4.73 3.41 1.70 0.30 0.30 Part marking W175 Electrical Characteristics IH IT Vmax Imax (A) (A) (V) (A) Current(A) 1.75 3.50 16 40 8.0 Part number LP-MSM175/16 Ttrip Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 1.50 1.00 0.025 0.090 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-MSM175/16 -40 -20 0 20 25 45 50 60 70 85 Hold Current (A) 2.68 2.35 2.07 1.79 1.75 1.47 1.37 1.26 1.05 0.86 Trip Current (A) 5.36 4.70 4.14 3.58 3.50 2.94 2.74 2.52 2.10 1.72 Solder Reflow Recommendations C Solder Pad Layouts B A B A B C (mm) (mm) (mm) LP-MSM175/16 3.45 1.78 3.15 * Recommended reflow methods: IR, Vapor phase, and hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Part number Package Information Tape & Reel: 1000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSM175/16 

Shang Hai Wayon Thermo-Electro

Дата модификации: 04.08.2022

Размер: 212.7 Кб

2 стр.

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