LP-MSM160/8

DOCUMENT: M20282 REV LETTER: D PAGE NO: 1 OF 2 REV DATE: 2019-11-12 PART NUMBER: LP-MSM160/8 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.ChinaTel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com Http://www.way-on.com Features Small size of 1812 Lead-free and compliant with the European Union RoHS Direc...
развернуть ▼ свернуть ▲

Технические характеристики

показать свернуть
Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
Нашли ошибку? Выделите её курсором и нажмите CTRL + ENTER

Файлы 1

показать свернуть
DOCUMENT: M20282 REV LETTER: D PAGE NO: 1 OF 2 REV DATE: 2019-11-12 PART NUMBER: LP-MSM160/8 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.ChinaTel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com Http://www.way-on.com Features Small size of 1812 Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast tripping resettable circuit protection Surface mount packaging for automated assembly Agency Recognition: UL Product Dimensions (mm) Part number A B C D E Max. Max. Max. Min. Min. 4.73 3.41 1.05 0.30 0.30 LP-MSM160/8 Electrical Characteristics Part number LP-MSM160/8 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 1.60 3.20 8 40 8.0 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 1.00 1.00 0.03 0.10 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Solder Reflow Recommendations C Solder Pad Layouts B A B A B C (mm) (mm) (mm) LP-MSM160/8 3.45 1.78 3.15 * Recommended reflow methods: IR, Vapor phase, and hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Part number Package Information Tape & Reel: 2000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSM160/8 

Shang Hai Wayon Thermo-Electro

Дата модификации: 02.08.2022

Размер: 207.8 Кб

2 стр.

    Внимание! Точность указанного на сайте описания товара не может быть гарантирована. Для получения более полной и точной информации о товаре смотрите техническое описание (Datasheet) на сайте производителя.