LP-MSM150/24

WAYON
DOCUMENT: M20070 REV LETTER: I PAGE NO: 1 OF 2 DATE: 2019-12-26 PART NUMBER： Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-MSM150/24 Http://www.way-on.com Features  Small size of 1812  Lead-free and compliant with the European Union RoHS...
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Внешний вид серии LP-MSM(L)

Технические характеристики

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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
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Аналоги 1

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Тип Наименование Корпус Упаковка i I удерж. I сраб. I макс U макс R Время Особенности Корпус Примечания T раб Карточка
товара
P= FSMD150-24R (FUZETEC)
 
SMD181245X32MM
 
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Файлы 1

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DOCUMENT: M20070 REV LETTER: I PAGE NO: 1 OF 2 DATE: 2019-12-26 PART NUMBER： Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-MSM150/24 Http://www.way-on.com Features  Small size of 1812  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Fast tripping resettable circuit protection  Surface mount packaging for automated assembly  Agency Recognition: UL、TUV Product Dimensions (mm) Part number LP-MSM150/24 A B C D E Max. Max. Max. Min. Min. 4.73 3.41 1.70 0.30 0.30 Part Marking W 150 Electrical Characteristics IH IT Vmax Imax (A) (A) (V) (A) Current(A) Time(S) (W) (Ω) (Ω) 1.50 3.00 24 40 8.0 0.50 1.0 0.04 0.11 Part number LP-MSM150/24 Ttrip Pd typ Rmin R1max IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-MSM150/24 -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 2.28 2.05 1.85 1.55 1.50 1.26 1.14 1.05 0.92 0.73 Trip Current (A) 4.56 4.10 3.70 3.10 3.00 2.52 2.28 2.10 1.84 1.46 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-MSM150/24 B A B A (mm) 3.45 B (mm) 1.78 C (mm) 3.15 * Recommended reflow methods: IR, Vapor phase, and hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 1000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSM150/24 

Shang Hai Wayon Thermo-Electro

Дата модификации: 28.12.2022

Размер: 229.9 Кб

2 стр.

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