LP-MSM150/16

WAYON
DOCUMENT: M20185 REV LETTER: G PAGE NO: 1 OF 2 DATE: 2020-06-11 PART NUMBER： Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com Http://www.way-on.com LP-MSM150/16 Features Small size of 1812 Lead-free and compliant with the European Union RoHS Direct...
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DOCUMENT: M20185 REV LETTER: G PAGE NO: 1 OF 2 DATE: 2020-06-11 PART NUMBER： Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com Http://www.way-on.com LP-MSM150/16 Features Small size of 1812 Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast tripping resettable circuit protection Surface mount packaging for automated assembly Agency Recognition: UL、TUV Product Dimensions (mm) Part number LP-MSM150/16 A B C D E Max. Max. Max. Min. Min. Part marking 4.73 3.41 1.70 0.30 0.30 W150 Electrical Characteristics IH IT Vmax Imax (A) (A) (V) (A) Current(A) Time(S) (W) (Ω) (Ω) 1.50 3.00 16 40 8.0 0.50 1.0 0.040 0.110 Part number LP-MSM150/16 Ttrip Pd typ Rmin R1max IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-MSM150/16 -40 2.28 4.56 Hold Current (A) Trip Current (A) -20 2.05 4.10 0 1.85 3.70 20 1.55 3.10 25 1.50 3.00 40 1.26 2.52 50 1.14 2.28 60 1.05 2.10 70 0.92 1.84 85 0.73 1.46 Solder Reflow Recommendations C Solder Pad Layouts B A B A B C (mm) (mm) (mm) LP-MSM150/16 3.45 1.78 3.15 * Recommended reflow methods: IR, Vapor phase, and hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Part number Package Information Tape & Reel: 1000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 1 PDF
Документация на LP-MSM150/16 

Shang Hai Changyuan Wayon

Дата модификации: 02.08.2022

Размер: 214.3 Кб

2 стр.

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