LP-MSM125/24

WAYON
DOCUMENT: M20892 REV LETTER: B PAGE NO: 1 OF 2 REV DATE: 2020-07-31 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Surface mount fuses LP-MSM125/24 Tel: 86-21- 50310888 50968308 Fax: 86-21-50757680 E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 1812  Lead-free and compliant with the Europe...
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DOCUMENT: M20892 REV LETTER: B PAGE NO: 1 OF 2 REV DATE: 2020-07-31 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Surface mount fuses LP-MSM125/24 Tel: 86-21- 50310888 50968308 Fax: 86-21-50757680 E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 1812  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Fast tripping resettable circuit protection  Surface mount packaging for automated assembly  Agency Recognition：UL、TUV Product Dimensions (mm) Part number A B C D E Max. Max. Max. Min. Min. 4.73 3.41 1.50 0.30 0.30 LP-MSM125/24 Part marking W 125 Electrical Characteristics IH IT Vmax Imax (A) (A) (V) (A) Current(A) 1.25 2.50 24 40 8.0 Part number LP-MSM125/24 Ttrip Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 0.40 1.0 0.04 0.25 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-MSM125/24 -40 -20 0 25 40 50 60 70 85 Hold Current (A) 1.89 1.64 1.41 1.25 1.09 0.98 0.86 0.74 0.56 Trip Current (A) 3.78 3.28 2.82 2.50 2.18 1.96 1.72 1.48 1.12 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-MSM125/24 B A B A (mm) 3.45 B (mm) 1.78 C (mm) 3.15 * Recommended reflow methods: IR, Vapor phase, and hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 2000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSM125/24 

Shang Hai Changyuan Wayon

Дата модификации: 04.08.2022

Размер: 218.4 Кб

2 стр.

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