LP-MSM110/16

WAYON
DOCUMENT: M20257 REV LETTER: G PAGE NO: 1 OF 2 REV DATE: 2020-09-23 PART NUMBER: LP-MSM110/16 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 1812  Lead-free and compliant with the European Union R...
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Внешний вид серии LP-MSM(L)

Технические характеристики

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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
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Аналоги 1

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Тип Наименование Корпус Упаковка i I удерж. I сраб. I макс U макс R Время Особенности Корпус Примечания T раб Карточка
товара
P= FSMD110-16-R (FUZETEC)
 
SMD181245X32MM в ленте 210 шт
 
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Файлы 1

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DOCUMENT: M20257 REV LETTER: G PAGE NO: 1 OF 2 REV DATE: 2020-09-23 PART NUMBER: LP-MSM110/16 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 1812  Lead-free and compliant with the European Union RoHS Directive (EU)2015/863  Fast tripping resettable circuit protection  Surface mount packaging for automated assembly  Agency Recognition: UL、TUV Product Dimensions (mm) Part number LP-MSM110/16 Part marking A B C D E Max. Max. Max. Min. Min. 4.73 3.41 1.05 0.30 0.30 W110 Electrical Characteristics Part number LP-MSM110/16 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 1.10 2.20 16 40 8.0 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 0.30 1.0 0.040 0.260 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating LP-MSM110/16 Maximum ambient operating temperature(℃) -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 1.65 1.50 1.32 1.15 1.10 0.99 0.85 0.78 0.68 0.52 Trip Current (A) 3.30 3.00 2.64 2.30 2.20 1.98 1.70 1.56 1.36 1.04 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-MSM110/16 B A B A B C (mm) (mm) (mm) 3.10 1.78 3.15 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 2000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice Page 1 of 2 PDF
Документация на LP-MSM110/16 

Shang Hai Wayon Thermo-Electro

Дата модификации: 27.09.2022

Размер: 224.8 Кб

2 стр.

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    MF-MSMF110/24X-2 (BOURNS)