LP-MSM010

DOCUMENT: M20106 REV LETTER: I PAGE NO: 1 OF 2 REV DATE: 2020-06-19 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-MSM010 Http://www.way-on.com Features Small size of 1812 Lead-free and compliant with the European Union RoHS Direct...
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Технические характеристики

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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
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Аналоги 1

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Тип Наименование Корпус Упаковка i I удерж. I сраб. I макс U макс R Время Особенности Корпус Примечания T раб Карточка
товара
P= FSMD010-R (FUZETEC)
 
SMD181245X32MM в ленте 2 шт
 

Файлы 1

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DOCUMENT: M20106 REV LETTER: I PAGE NO: 1 OF 2 REV DATE: 2020-06-19 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-MSM010 Http://www.way-on.com Features Small size of 1812 Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast tripping resettable circuit protection Surface mount packaging for automated assembly Agency Recognition: UL、TUV Product Dimensions (mm) Part number A B C D E Max. Max. Max. Min. Min. 4.73 3.41 1.00 0.30 0.30 LP-MSM010 Part Marking W 010 Electrical Characteristics Part number LP-MSM010 IH IT Vmax Imax (A) (A) (V) (A) Current(A) Ttrip Time(S) Pd typ (W) Rmin R1max (Ω) (Ω) 0.10 0.20 60 10 1.5 0.15 1.0 1.60 15.00 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-MSM010 -40 -20 0 25 40 50 60 70 85 Hold Current (A) 0.17 0.16 0.14 0.10 0.08 0.07 0.06 0.05 0.04 Trip Current (A) 0.34 0.32 0.28 0.20 0.16 0.14 0.12 0.10 0.08 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-MSM010 B A B A B C (mm) (mm) (mm) 3.45 1.78 3.15 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 2000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Operating Temperature Range:-40℃~ 85℃ Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSM010 

Shang Hai Wayon Thermo-Electro

Дата модификации: 24.06.2022

Размер: 229.2 Кб

2 стр.

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