LP-ISML450

WAYON
DOCUMENT: M20375 REV LETTER: F PAGE NO: 1 OF 2 REV DATE: 2020-07-06 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses LP-ISML450 E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 0805  Low risistance  Lead-free and compliant with th...
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Внешний вид серии LP-ISM(L)

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DOCUMENT: M20375 REV LETTER: F PAGE NO: 1 OF 2 REV DATE: 2020-07-06 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses LP-ISML450 E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 0805  Low risistance  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Fast time-to-trip  Agency Recognition: UL 、TUV Product Dimensions (mm) Part number LP-ISML450 A B C D E Max. Max. Max. Min. Min. 2.50 1.60 1.00 0.20 0.05 Electrical Characteristics Part number LP-ISML450 IH IT Vmax Imax Pd typ Rmin R1max (A) (A) (V) (A) Current(A) Ttrip Time(S) (W) (Ω) (Ω) 4.50 9.00 6 50 8.0 5.0 1.2 0.002 0.012 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-ISML450 -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 7.20 5.60 4.88 4.70 4.50 3.56 3.30 2.90 2.45 1.76 Trip Current (A) 14.40 11.20 9.76 9.40 9.00 7.12 6.60 5.80 4.90 3.52 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-ISML450 B A B A B C (mm) (mm) (mm) 1.20 1.00 1.50 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 3000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-ISML450 

Shanghai Changyuan Wayon Circuit protection Co., Ltd

Дата модификации: 17.08.2022

Размер: 233.8 Кб

2 стр.

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