LP-ISML300

WAYON
DOCUMENT: M20247 REV LETTER: H PAGE NO: 1 OF 2 REV DATE: 2019-10-12 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-ISML300 Http://www.way-on.com Features Small size of 0805 Low risistance Lead-free and compliant with the European Un...
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Внешний вид серии LP-ISM(L)

Технические характеристики

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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
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DOCUMENT: M20247 REV LETTER: H PAGE NO: 1 OF 2 REV DATE: 2019-10-12 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-ISML300 Http://www.way-on.com Features Small size of 0805 Low risistance Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast time-to-trip Agency Recognition: UL、TUV Product Dimensions (mm) A B C D E Typ. Typ. Typ. Typ. Typ. Part marking 2.30±0.20 1.40±0.20 0.80±0.20 0.45±0.15 0.20±0.15 b Part number LP-ISML300 Electrical Characteristics Part number LP-ISML300 IH IT Vmax Imax (A) (A) (V) (A) Current(A) Ttrip Time(S) Pd typ (W) Rmin R1max (Ω) (Ω) 3.00 6.00 8 50 8.0 5.0 1.20 0.005 0.020 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-ISML300 -40 4.01 8.02 Hold Current (A) Trip Current (A) -20 3.50 7.00 0 3.25 6.50 20 3.02 6.05 25 3.00 6.00 40 2.50 5.00 50 2.20 4.40 60 2.10 4.20 70 1.70 3.40 85 1.20 2.40 Solder Reflow Recommendations C Solder Pad Layouts B A B A B C (mm) (mm) (mm) LP-ISML300 1.20 1.00 1.50 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Part number Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-ISML300 

Shanghai Changyuan Wayon Circuit protection Co., Ltd

Дата модификации: 14.10.2022

Размер: 239 Кб

2 стр.

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