LP-ISML260

WAYON
DOCUMENT: M20362 REV LETTER: H PAGE NO: 1 OF 2 DATE: 2019-10-12 PART NUMBER： Polymer PTC Devices Wayon Electronics Co., Ltd No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com LP-ISML260 Features Small size of 0805 Low risistance Lead-free and compliant with the European Union...
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DOCUMENT: M20362 REV LETTER: H PAGE NO: 1 OF 2 DATE: 2019-10-12 PART NUMBER： Polymer PTC Devices Wayon Electronics Co., Ltd No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com LP-ISML260 Features Small size of 0805 Low risistance Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast time-to-trip Agency Recognition: UL、CSA、TUV Product Dimensions (mm) Part number LP-ISML260 A B C D E Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. 2.00 2.50 1.20 1.60 0.40 0.70 0.20 0.55 0.05 0.45 Part marking a Electrical Characteristics Part number LP-ISML260 IH IT Vmax Imax Pd typ Rmin R1max (A) (A) (V) (A) Current(A) Ttrip Time(S) (W) (Ω) (Ω) 2.60 5.20 8 50 8.0 4.0 0.60 0.007 0.030 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-ISML260 -40 -20 0 20 25 45 50 60 70 85 Hold Current (A) 3.45 3.01 2.76 2.62 2.60 2.00 1.90 1.75 1.45 1.00 Trip Current (A) 6.90 6.02 5.52 5.24 5.20 4.00 3.80 3.50 2.90 2.00 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-ISML260 B A B A B C (mm) (mm) (mm) 1.20 1.00 1.50 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-ISML260 

Shanghai Changyuan Wayon Circuit protection Co., Ltd

Дата модификации: 14.10.2022

Размер: 230.6 Кб

2 стр.

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