LP-ISML110

WAYON
DOCUMENT: M20716 REV LETTER: F PAGE NO: 1 OF 2 REV DATE: 2019-10-12 PART NUMBER: Polymer PTC Devices Surface mount fuses LP-ISML110 Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com E-mail: market@way-on.com Features Small size of 0805 Low resistance Lead-free and compliant with the European U...
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DOCUMENT: M20716 REV LETTER: F PAGE NO: 1 OF 2 REV DATE: 2019-10-12 PART NUMBER: Polymer PTC Devices Surface mount fuses LP-ISML110 Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com E-mail: market@way-on.com Features Small size of 0805 Low resistance Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast time-to-trip Agency Recognition: UL、TUV Product Dimensions (mm) A B C D E Typ. Typ. Typ. Typ. Typ. 2.30±0.20 1.40±0.20 0.60±0.20 0.40±0.20 0.25±0.20 Part number LP-ISML110 Part marking 6 Electrical Characteristics Part number LP-ISML110 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 1.10 3.30 6 50 8.0 Pd typ Rmin R1max R2max Time(S) (W) (Ω) (Ω) (Ω) 5 0.60 0.010 0.120 0.130 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. R2max= Maximum device resistance range measured in the nontripped state 1 hour post reflow then heat curing . Thermal Derating Maximum ambient operating temperature(℃) LP-ISML110 -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 1.60 1.45 1.25 1.13 1.10 0.95 0.80 0.75 0.66 0.50 Trip current(A) 4.80 4.35 3.75 3.39 3.30 2.85 2.81 2.25 1.98 1.50 Solder Reflow Recommendations C Solder Pad Layouts B A B A B C (mm) (mm) (mm) LP-ISML110 1.20 1.00 1.50 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Part number Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-ISML110 

Shanghai Changyuan Wayon Circuit protection Co., Ltd

Дата модификации: 10.01.2022

Размер: 243.7 Кб

2 стр.

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