LP-ISM050

DOCUMENT: M20116 REV LETTER: H PAGE NO: 1 OF 2 REV DATE: 2019-10-10 PART NUMBER: Polymer PTC Devices Wayon Electronics Co.,Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com E-mail: market@way-on.com Surface mount fuses LP-ISM050 Features Small size of 0805 Halogen-free Lead-free and compliant with the European Unio...
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Технические характеристики

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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
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Аналоги 1

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Тип Наименование Корпус Упаковка i I удерж. I сраб. I макс U макс R Время Особенности Корпус Примечания T раб Карточка
товара
P= FSMD050-0805R (FUZETEC)
 
SMD080520X125MM в ленте 100 шт
 

Файлы 1

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DOCUMENT: M20116 REV LETTER: H PAGE NO: 1 OF 2 REV DATE: 2019-10-10 PART NUMBER: Polymer PTC Devices Wayon Electronics Co.,Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com E-mail: market@way-on.com Surface mount fuses LP-ISM050 Features Small size of 0805 Halogen-free Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast tripping resettable circuit protection Surface mount packaging for automated assembly Agency Recognition: UL、TUV Product Dimensions (mm) Part number A B C D E Max. Max. Max. Min. Min. Part marking LP-ISM050 2.50 1.60 1.25 0.20 0.10 4 Electrical Characteristics IH IT Vmax Imax (A) (A) (V) (A) Current(A) 0.50 1.00 6.00 40.0 8.00 Part number LP-ISM050 Ttrip Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 0.10 0.5 0.15 0.85 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-ISM050 -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 0.76 0.66 0.58 0.51 0.50 0.43 0.38 0.34 0.30 0.24 Trip Current (A) 1.52 1.32 1.16 1.02 1.00 0.86 0.76 0.67 0.60 0.48 Solder Reflow Recommendations C Solder Pad Layouts B A B Part number A (mm) 1.20 B (mm) 1.00 C (mm) 1.50 LP-ISM050 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-ISM050 

Shang Hai Wayon Thermo-Electro

Дата модификации: 10.07.2022

Размер: 219.1 Кб

2 стр.

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