LP-ISM035

WAYON
DOCUMENT: M20266 REV LETTER: G PAGE NO: 1 OF 2 DATE: 2020-03-02 PART NUMBER : LP-ISM035 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses Http://www.way-on.com E-mail: market@way-on.com Features  Small size of 0805  Lead-free and compliant with the European Union RoHS D...
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Внешний вид серии LP-ISM(L)

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Ток срабатывания
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DOCUMENT: M20266 REV LETTER: G PAGE NO: 1 OF 2 DATE: 2020-03-02 PART NUMBER : LP-ISM035 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses Http://www.way-on.com E-mail: market@way-on.com Features  Small size of 0805  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Fast tripping resettable circuit protection  Surface mount packaging for automated assembly  Agency Recognition: UL、TUV Product Dimensions (mm) Part number LP-ISM035 A B C D E Max. Max. Max. Min. Min. Part marking 2.50 1.60 0.75 0.20 0.10 3 Electrical Characteristics Part number LP-ISM035 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 0.35 0.75 6.00 40.0 8.00 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 0.10 0.5 0.25 1.20 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-ISM035 Hold Current (A) Trip Current (A) -40 0.51 1.10 -20 0.45 0.96 0 0.40 0.85 20 0.36 0.78 25 0.35 0.75 40 0.30 0.62 50 0.26 0.53 60 0.25 0.50 70 0.21 0.42 85 0.16 0.32 Solder Reflow Recommendations C Solder Pad Layouts B A B Part number A (mm) 1.20 B (mm) 1.00 C (mm) 1.50 LP-ISM035 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-ISM035 

Shang Hai Wayon Thermo-Electro

Дата модификации: 04.07.2022

Размер: 234 Кб

2 стр.

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