LP-ISM010

WAYON
DOCUMENT: M20049 REV LETTER: K PAGE NO: 1 OF 2 REV DATE: 2020-01-19 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-ISM010 Http://www.way-on.com Features Small size of 0805 Lead-free and compliant with the European Union RoHS Direct...
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Внешний вид серии LP-ISM(L)

Технические характеристики

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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
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Аналоги 1

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Тип Наименование Корпус Упаковка i I удерж. I сраб. I макс U макс R Время Особенности Корпус Примечания T раб Карточка
товара
P= FSMD010-0805-R (FUZETEC)
 
SMD080520X125MM 1000 шт
 
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Файлы 1

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DOCUMENT: M20049 REV LETTER: K PAGE NO: 1 OF 2 REV DATE: 2020-01-19 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-ISM010 Http://www.way-on.com Features Small size of 0805 Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast tripping resettable circuit protection Surface mount packaging for automated assembly Agency Recognition: UL 、TUV Product Dimensions (mm) LP-ISM010 Part marking A B C D E Typ. Typ. Typ. Typ. Typ. 2.25±0.25 1.40±0.20 0.60±0.40 0.50±0.30 0.30±0.20 Part number 0 Electrical Characteristics Part number LP-ISM010 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 0.10 0.30 15.0 10.0 0.50 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 1.50 0.5 1.00 6.00 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperatures(℃) LP-ISM010 -40 -20 0 25 40 50 60 70 85 Hold Current (A) 0.14 0.13 0.12 0.10 0.09 0.08 0.07 0.06 0.04 Trip Current (A) 0.42 0.39 0.36 0.30 0.27 0.24 0.21 0.18 0.12 Solder Reflow Recommendations Solder Pad Layouts A B C (mm) (mm) (mm) LP-ISM010 1.20 1.00 1.50 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. C Part number B A B Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-ISM010 

Shang Hai Wayon Thermo-Electro

Дата модификации: 22.02.2022

Размер: 243.5 Кб

2 стр.

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