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MXC4005XC

MEMSIC
Monolithic and Wafer Level Packaged Three-Axis Accelerometer MXC400xXC FEATURES  Ultra Low Cost  Most Advantaged Technology in Industry  Monolithically-Integrated Single Chip MEMS Sensor with On-Chip Signal Processing  MEMSIC Proprietary Technology with No Moving Parts  >200,000g Shock Survival Rating of Sensing Structure  12-bit Signal Output for X, Y and Z Axes  Full Scale Range ±2...
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Внешний вид MXC4005XC

Технические характеристики

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Рабочие оси
Диапазон измерения
Выходной интерфейс
Напряжение питания
Ток потребления
Рабочая температура
Примечания Zero-g offset = 80 mg; 1.18x1.7x0.85 6pin WLP; 7-bit I2C Address -15H
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Monolithic and Wafer Level Packaged Three-Axis Accelerometer MXC400xXC FEATURES  Ultra Low Cost  Most Advantaged Technology in Industry  Monolithically-Integrated Single Chip MEMS Sensor with On-Chip Signal Processing  MEMSIC Proprietary Technology with No Moving Parts  >200,000g Shock Survival Rating of Sensing Structure  12-bit Signal Output for X, Y and Z Axes  Full Scale Range ±2g, ±4g and ±8g  8-bit Temperature Output (-50°C to +100°C)  Smallest Wafer Level Package (WLP) Footprint 1.18mm×1.70mm×0.85mm  6-Position Orientation Detection  Shake Detection with Interrupt  Programmable Shake Detection Threshold  I2C Slave, FAST (≤400 KHz) Mode Interface  1.8~3.6V Single Supply Continuous Operation  1.8V Compatible I/O  Embedded Power Up/Down Mode  Eight I2C Addresses Pre-settable by User  RoHS Compliant APPLICATIONS  Information Appliances – Cell Phones, Tablets, PDA’s, Computer Peripherals  Consumer – LCD Projectors, Pedometers, DSC/DVC, MP3/MP4  Gaming – Joystick, Toys  Household Safety – Heating Fan, Iron, Cooling Fan there is no measurable resonance (immunity to vibration), no stiction, and no detectable hysteresis. It also eliminates the "click" sounds typically heard in ball based orientation sensors. Shock survival of the MEMS sensing structure is greater than 200,000g. This sensor provides X/Y/Z axis acceleration signals with very low 0g offset, and temperature signal with high accuracy. In addition, it detects six orientation positions, X/Y shake and shake directions. VDD 3-Axis Sensor Clock& Timing Generation SCL SDA AMP & ADC MUX Reference& Bias Generation Control & Data Register DSP I2C Interface GND Figure 1: MXC400xXC Functional block diagram The MXC400xXC is the World's only monolithic and WLP three-axis accelerometer with smallest profile of 1.18mm×1.70mm×0.85mm that is perfectly suitable for mobile applications. It is available in operating temperature range of -40°C to +85°C. The MXC400xXC provides I2C digital output with 400 KHz fast mode operation. And an interrupt pin (INT) is provided for orientation and X/Y shake detections. The device also has a power-down mode enabled through the I2C interface. DESCRIPTION The MEMSIC Three-Axis Thermal Accelerometer is based on MEMSIC’s Proprietary thermal technology that is built with 0.18µm standard CMOS process and the most advanced Wafer Level Packaging. This device contains no moving sensor parts and thus eliminates field reliability and repeatability issues associated with competitive products. For example, Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its use, nor for any infringements of patents or other rights of third parties, which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of MEMSIC. MEMSIC MXC400xXC Datasheet Rev.B www.MEMSIC.com Page 1 of 13 Formal release date: 2015/04/24 INT PDF
Документация на MXC4000XC 

MXC400xXC

Дата модификации: 22.01.2023

Размер: 613.3 Кб

13 стр.

Monolithic and Wafer Level Packaged Three-Axis Accelerometer MXC400xXC FEATURES  Ultra Low Cost  Most Advantaged Technology in Industry  Monolithically-Integrated Single Chip MEMS Sensor with On-Chip Signal Processing  MEMSIC Proprietary Technology with No Moving Parts  >200,000g Shock Survival Rating of Sensing Structure  12-bit Signal Output for X, Y and Z Axes  Full Scale Range ±2g, ±4g and ±8g  8-bit Temperature Output (-50°C to +100°C)  Smallest Wafer Level Package (WLP) Footprint 1.18mm×1.70mm×0.85mm  6-Position Orientation Detection  Shake Detection with Interrupt  Programmable Shake Detection Threshold  I2C Slave, FAST (≤400 KHz) Mode Interface  1.8~3.6V Single Supply Continuous Operation  1.8V Compatible I/O  Embedded Power Up/Down Mode  Eight I2C Addresses Pre-settable by User  RoHS Compliant APPLICATIONS  Information Appliances – Cell Phones, Tablets, PDA’s, Computer Peripherals  Consumer – LCD Projectors, Pedometers, DSC/DVC, MP3/MP4  Gaming – Joystick, Toys  Household Safety – Heating Fan, Iron, Cooling Fan there is no measurable resonance (immunity to vibration), no stiction, and no detectable hysteresis. It also eliminates the "click" sounds typically heard in ball based orientation sensors. Shock survival of the MEMS sensing structure is greater than 200,000g. This sensor provides X/Y/Z axis acceleration signals with very low 0g offset, and temperature signal with high accuracy. In addition, it detects six orientation positions, X/Y shake and shake directions. VDD 3-Axis Sensor Clock& Timing Generation SCL SDA AMP & ADC MUX Reference& Bias Generation Control & Data Register DSP 2 IC Interface GND Figure 1: MXC400xXC Functional block diagram The MXC400xXC is the World's only monolithic and WLP three-axis accelerometer with smallest profile of 1.18mm×1.70mm×0.85mm that is perfectly suitable for mobile applications. It is available in operating temperature range of -40°C to +85°C. The MXC400xXC provides I2C digital output with 400 KHz fast mode operation. And an interrupt pin (INT) is provided for orientation and X/Y shake detections. The device also has a power-down mode enabled through the I2C interface. DESCRIPTION The MEMSIC Three-Axis Thermal Accelerometer is based on MEMSIC’s Proprietary thermal technology that is built with 0.18µm standard CMOS process and the most advanced Wafer Level Packaging. This device contains no moving sensor parts and thus eliminates field reliability and repeatability issues associated with competitive products. For example, Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its use, nor for any infringements of patents or other rights of third parties, which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of MEMSIC. MEMSIC MXC400xXC Datasheet Rev.B Page 1 of 13 MEMSIC, Inc. One Technology Drive, Suite 325, Andover, MA01810, USA Tel: +1 978 738 0900 Fax: +1 978 738 0196 www.MEMSIC.com Formal release date: 2015/04/24 INT PDF
Документация на MXC4005XC 

Microsoft Word - MXC400xXC Datasheet Rev.B

Дата модификации: 24.04.2015

Размер: 413.2 Кб

13 стр.

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