LP-MSML800

DOCUMENT: M20756 REV LETTER: C PAGE NO: 1 OF 2 REV DATE: 2019-12-05 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses LP-MSML800 E-mail: market@way-on.com Http://www.way-on.com Features Small size of 1812 Low resistance Lead-free、Halogen-free and compliant with...
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DOCUMENT: M20756 REV LETTER: C PAGE NO: 1 OF 2 REV DATE: 2019-12-05 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses LP-MSML800 E-mail: market@way-on.com Http://www.way-on.com Features Small size of 1812 Low resistance Lead-free、Halogen-free and compliant with the European Union RoHS Directive 2011/65/EU Fast time-to-trip Agency Recognition: UL、TUV Product Dimensions (mm) Part number LP-MSML800 A B C D E Min. Max. Min. Max. Min. Max. Min. Min. 4.37 4.73 3.07 3.41 0.60 1.00 0.30 0.10 Electrical Characteristics Maximum Electrical Rating  Operating Voltage: 6 Vdc  Interrupt Current: 50 A PART NUMBER HOLD CURRENT AND TRIP CURRENT (AMPS) 25℃ LP-MSML800 Hold 60℃ Trip Hold Trip 8.00 16.00 5.50 11.00 *: Maximum resistance is measured 1 hour after reflow. TIME-TO-TRIP (SECONDS) REFERENCE RESISTANCE (OHMS) TRIPPED STATE POWER DISSIPATION (WATTS) 40 A @ 25℃ 25℃ 25℃,6V Min. Max. Min. Max. * Max. - 5.0 0.0005 0.007 1.5 Thermal Derating LP-MSML800 Hold Current (A) Maximum ambient operating temperature(℃) -40 -20 0 20 25 40 50 60 70 85 11.78 10.56 9.25 8.23 8.00 7.05 6.25 5.50 4.95 3.95 Trip Current (A) 23.56 21.12 18.50 16.46 16.00 14.10 12.50 11.00 9.90 7.90 The above parameters are concluded from one time of reflow soldering processing the PTC. If there is any further heat gene *Value specified were determined using the PWB with 3.4mm*1.0oz copper traces. Solder Reflow Recommendations C Solder Pad Layouts B A B A B C (mm) (mm) (mm) LP-MSML800 3.45 1.78 3.15 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Part number Package Information Tape & Reel: 2000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSML800 

Shang Hai Wayon Thermo-Electro

Дата модификации: 08.12.2022

Размер: 234.1 Кб

2 стр.

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