LP-MSM260/16

WAYON
DOCUMENT: M21296 REV LETTER: A PAGE NO: 1 OF 2 DATE: 2021-10-29 PART NUMBER： Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface Mount Thermistor E-mail: market@way-on.com LP-MSM260/16 Http://www.way-on.com LP-MSM260/16 Features Lead-free, RoHS compliant and IATF16949 certified Surface m...
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DOCUMENT: M21296 REV LETTER: A PAGE NO: 1 OF 2 DATE: 2021-10-29 PART NUMBER： Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface Mount Thermistor E-mail: market@way-on.com LP-MSM260/16 Http://www.way-on.com LP-MSM260/16 Features Lead-free, RoHS compliant and IATF16949 certified Surface mount packaging for automated assembly Fast tripping resettable circuit protection Small size 1812 Agency Recognition: UL Product Dimension (mm) Part Number LP-MSM260/16 A B C D E Max. Max. Max. Min. Min. Part Marking 4.83 3.41 2.00 0.30 0.20 W260 Electrical Characteristics Part Number LP-MSM260/16 IH (A) 2.60 IT (A) 5.20 Vmax (V) 16 Imax (A) 40 Ttrip Current(A) Time(S) 8.00 5.00 Pd typ (W) 1.00 Rmin (Ω) 0.015 R1 max (Ω) 0.070 IH=Hold current: maximum current at which the device will not trip at 25 oC still air. IT=Trip current: minimum current at which the device will always trip at 25 oC still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25oC prior to tripping. R1 max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating LP-MSM260/16 -40 3.80 7.60 Hold Current (A) Trip Current (A) -20 3.51 7.02 Maximum ambient operating temperatures(oC) 0 25 40 50 60 3.12 2.60 2.28 2.10 1.85 6.24 5.20 4.56 4.20 3.70 70 1.61 3.22 85 1.29 2.58 Solder Reflow Recommendation C Solder Pad Layout Part Number A B C (mm) (mm) (mm) 3.10 1.68 3.20 LP-MSM260/16 B A B * Recommended reflow methods: IR, vapor phase, hot air oven. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 1000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSM260/16 

Shang Hai Wayon Thermo-Electro

Дата модификации: 04.11.2022

Размер: 501.3 Кб

2 стр.

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